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Colleges

Material engineering

Course Description: This course will cover the principles of materials science and engineering as they relate to microelectronics packaging. Material classes - polymers, ceramics, and metals - and their structure-processing-property relationships will be studied. Topics to be covered specifically include phase diagrams, diffusion and mass transport, bonding and adhesion, material testing methods, and material characterization techniques.
Credit hours: 3
Prerequisites: GE 105
Objectives of the course :

1. Teaching the principles of materials science and engineering.
Teaching materials science, polymers, ceramics, and metals.
3. Teaching the relationship between structure, processing, and properties.
4. Teaching students how to analyze phase diagrams.
5. Teaching the laws of diffusion and mass transfer.
6. Teaching crystal structure, crystal systems, bonding, and their relationship to material properties.
7. Teaching methods of material testing and interpretation of data obtained from these tests.
8. Teaching the main methods of material processing.

Course outputs :

1.1 Identifying the main categories of engineering materials.
1.2 Gather key ideas for defining crystal structure in different categories of materials.
1.3 Calling Common Manufacturing and Heat Treatment Processes
1.4 Description of important mechanical properties of engineering materials.
1.5 Define the basic laws of diffusion.
1.6 Identifying key processing methods for engineering materials.
1.7 Description of the Main Characteristics of Polymeric and Ceramic Materials
2.1 Conduct interpretation and make decisions regarding the results obtained from various mechanical tests and relate them to material processing, structure, composition, and durability.
2.2 Constructing crystal structures for different materials and relating them to their properties.
2.3 Principles of Material Design and Selection under Service Conditions.
3.1 Material and Design Selection Criteria for a Specific Application.
3.2 Design of a heat treatment system to achieve desired properties.
3.3 Solving Scatter and Phase Diagrams in Real Case Studies.

Additional information:

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